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The SmartView NT automated bond alignment system for universal alignment offers a proprietary method for micron-level face-to-face wafer-level alignment.
• Wafer stacking for 3D interconnect, wafer-level packaging and high-volume MEMS devices.
• Bond pairs are aligned and clamped prior to loading into the bond chamber (for anodic, adhesive and glass frit bonding).
• Manual or fully automated configurations.
• Suitable for automated process line in 200 mm and 300 mm configurations.
Methoden & Expertise zur Forschungsinfrastruktur
Wafer stacking for 3D interconnect, wafer-level packaging and high-volume MEMS devices.