ATC-ORION 8 UHV Sputtering System

Institute of Science and Technology Austria (ISTA)

Klosterneuburg | Website



AJA Orion 8 Sputtering System is capable of depositing metal and insulating films with RF generators and three DC generators. Each sputtering sources has integral isolation chimneys, pneumatic shutters and individual gas injection capability. The tool is equipped with a load lock and sputtering chamber with manual sample transfer and computer-controlled deposition. Reactive sputtering with oxygen also available as well. Substrate holder mounts to top of and accommodates substrates up to 4″ diameter. It has continuous motorized rotation (0-40RPM) with controller and radiant heating to 850° C with quartz halogen lamps. Substrate lift for load-lock transfer and working distance adjustment via edge welded bellows also possible.

Process Gases: Ar (0 – 50 sccm) and O2 (0 – 20 sccm)
RF-Magnetron: 300 Watts maximum
DC-Magnetron: 750 Watts maximum
Available targets: Available Targets: Au, Pd, Ti, Cr, ITO, ZnO
Load-lock pressure: 3.8 x 10-6 Torr and Process chamber pressure: 4.8 x 10-8 Torr


Dr. Salvatore Bagiante

Research Services


Methoden & Expertise zur Forschungsinfrastruktur

Micro- and nanofabrication processing, development of new processes, characterization, training

Zuordnung zur Core Facility

Nanofabrication Facility

Information on terms of use, cooperation and fees is provided upon request. All such information is defined in a scientific collaboration agreement.