Mask Aligner

Institute of Science and Technology Austria (IST Austria)

Klosterneuburg | Website

Großgerät

Kurzbeschreibung

The EVG 610 is a semi-automated system that can handle small substrate pieces and wafers up to 200 mm. The tool supports lithography processes, such as vacuum-, soft-, hard- and proximity exposure mode, as well as other specific applications, including bond alignment, nano imprint lithography (NIL) and micro contact printing.

- Supports back side lithography and bond alignment processes when configured with bottom side microscopes
- Sub-micron exposure gap repeatability in proximity exposure mode
- Unmatched exposure light uniformity at wafer level, down to ± 1.5% for small substrate applications
- Windows based user interface

Ansprechperson

Dr. Salvatore Bagiante

Research Services

Physics

Methoden & Expertise zur Forschungsinfrastruktur

Micro- and nanofabrication processing, development of new processes, characterization, training

Zuordnung zur Core Facility

Cleanroom

Information on terms of use, cooperation and fees is provided upon request. All such information is defined in a scientific collaboration agreement.