ATC-2200-UHV Sputtering System

Institute of Science and Technology Austria (ISTA)

Klosterneuburg | Website

Large equipment

Short Description

The AJA ATC-2200-UHV Sputtering System is capable of depositing metal and insulating films with seven 2 inches and one 4 inch magnetron sputtering sources. Each sputtering sources has integral isolation chimneys, pneumatic shutters, and individual gas injection capability via port on cluster flange. The tool is equipped with a load lock and sputtering chamber with manual sample transfer and computer-controlled deposition. Reactive sputtering with Nitrogen is also available as well. Substrate holder mounts to top of the chamber for sputter up orientation and accommodates substrates up to 4″ diameter. It has continuous motorized rotation (0-40RPM) with a controller and radiant heating to 850° C with quartz halogen lamps. Substrate lift for load-lock transfer and working distance adjustment via edge welded bellows are also possible.

Process Gases: Ar (0 – 50 sccm) and N2 (0 – 20 sccm)
RF-Magnetron: 600 Watts maximum
DC-Magnetron: 1500 Watts maximum
Available targets: Available Targets: NbTi, Ta, Al, Ti and SiO2
Load-lock pressure: 3.8 x 10-6 Torr and Process chamber pressure: 2 x 10-9 Torr

Contact Person

Salvatore Bagiante

Research Services


Methods & Expertise for Research Infrastructure

Micro- and nanofabrication processing, development of new processes, characterization, training

Allocation to Core Facility

Nanofabrication Facility

Information on terms of use, cooperation and fees is provided upon request. All such information is defined in a scientific collaboration agreement.