Short Description
AJA Orion 8 Sputtering System is capable of depositing metal and insulating films with RF generators and three DC generators. Each sputtering sources has integral isolation chimneys, pneumatic shutters and individual gas injection capability. The tool is equipped with a load lock and sputtering chamber with manual sample transfer and computer-controlled deposition. Reactive sputtering with oxygen also available as well. Substrate holder mounts to top of and accommodates substrates up to 4″ diameter. It has continuous motorized rotation (0-40RPM) with controller and radiant heating to 850° C with quartz halogen lamps. Substrate lift for load-lock transfer and working distance adjustment via edge welded bellows also possible.
Process Gases: Ar (0 – 50 sccm) and O2 (0 – 20 sccm)
RF-Magnetron: 300 Watts maximum
DC-Magnetron: 750 Watts maximum
Available targets: Available Targets: Au, Pd, Ti, Cr, ITO, ZnO
Load-lock pressure: 3.8 x 10-6 Torr and Process chamber pressure: 4.8 x 10-8 Torr
Contact Person
Dr. Salvatore Bagiante
Research Services
Metals and insulators deposition and sample preparation.
Methods & Expertise for Research Infrastructure
Micro- and nanofabrication processing, development of new processes, characterization, training