Mask Aligner

Institute of Science and Technology Austria (IST Austria)

Klosterneuburg | Website

Large equipment

Short Description

The EVG 610 is a semi-automated system that can handle small substrate pieces and wafers up to 200 mm. The tool supports lithography processes, such as vacuum-, soft-, hard- and proximity exposure mode, as well as other specific applications, including bond alignment, nano imprint lithography (NIL) and micro contact printing.

- Supports back side lithography and bond alignment processes when configured with bottom side microscopes
- Sub-micron exposure gap repeatability in proximity exposure mode
- Unmatched exposure light uniformity at wafer level, down to ± 1.5% for small substrate applications
- Windows based user interface

Contact Person

Dr. Salvatore Bagiante

Research Services


Methods & Expertise for Research Infrastructure

Micro- and nanofabrication processing, development of new processes, characterization, training

Allocation to Core Facility

Nanofabrication Facility

Information on terms of use, cooperation and fees is provided upon request. All such information is defined in a scientific collaboration agreement.