Klosterneuburg | Website
The Oxford FlexAL systems provide a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma atomic layer deposition (ALD) processes and thermal ALD within a single system. This system deliver maximum flexibility in the choice of materials and precursors, low-temperature processes enabled by plasma ALD, and repeatable processes via recipe-driven software interface.
Currently installed precursors: for HfO2 and Al2O3 deposition.
Remote plasma & thermal ALD in one flexible tool
Automated 200mm load lock for process flexibility
Low-temperature processes enabled by plasma ALD
Low damage maintained by the use of remote plasma
Ability to handle from small wafer pieces up to full 200mm wafers
Integral glove box on precursor modules for in-situ change-over
Max deposition temperature 400ºC
ICP source 300W at 13.56 MHz
Electrode diameter 240 mm
Dr. Salvatore Bagiante
Methods & Expertise for Research Infrastructure
Micro- and nanofabrication processing, development of new processes, characterization, training