Silicon Austria Labs GmbH (SAL)
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Short Description
Magnetron sputtering clustertool for various thin film single and multilayers on 200 mm wafers.
Contact Person
Heimo Müller
Research Services
Research Services
• Metal, oxide, and nitride thin film sputtering from 5 modules
• (Pulsed) DC, RF, reactive/non-reactive, and co-sputtering capabilities
• Co-sputtering from up-to 4 targets in multisource module
• In-vacuo transport of wafers between modules and pre-treatment units
• Automated processing of 25 wafer batch
• Material examples: Pt, Ti, TiO2, SiO2 Mo, Al, W, AlN, AlScN, and many more on request
Methods & Expertise for Research Infrastructure
Magnetron sputtering – Evatec Clusterline 200E:
- 2 multisource modules for oxides/nitrides (+ HiPIMS generator), PZT module, single target nitride module with hot chuck, soft etch module, PEALD (2023)
Allocation to Core Facility
The terms of use are to be agreed individually. Send your request to the indicated contact. The GTC of SAL apply: https://silicon-austria-labs.com/agb/