Short Description
AT&S has purchased a physical thin film system “Clusterline 600” from Evatec. This system enables AT&S and you to dive into the world of semiconductor processes. The process technology is so novel that AT&S is currently the only European PCB and IC substrate manufacturer to operate such a facility. This new technology is used for the development of next-generation IC substrates, novel embedding concepts, heterogeneous integration, advanced packaging and FO-PLP (Fan-Out – Panel Level Packaging).
The PVE/PVD system in brief:
+ Substrate sizes from coupons (3×3 cm) up to 625x625mm.
+ Titanium deposition: 25-100 nm
+ Copper deposition: 25-300 nm
+ Materials: FR4 and films (e.g. polyimide, ABD, …)
Purpose:
+ Coating of dielectric PCB material with titanium and copper.
+ Contacting of embedded components (no copper termination on front/back side) without laser drilling.
+ Reactive etching and
+ Plating of z-axis interconnects of next generation printed circuit boards/IC-S dielectrics.
Contact Person
Gernot Schulz
Research Services
Do you have an idea? Then take advantage of this unique opportunity to conduct experiments with a completely new technology that is not yet established in the PCB/IC-Substrate industry. Thin film deposition has become an integral part of the semiconductor, optical and tribological world. You have the opportunity to pre-test these new concepts.
The test possibilities include tests on:
+ Vacuum suitability of the envisioned materials for your application.
+ Thin film coatings on new types of printed circuit board materials or embedded components
Methods & Expertise for Research Infrastructure
The equipment is primarily used in the electronics industry. The physical thin-film equipment is used to deposit metals, in this case titanium (as an adhesion promoter) and copper. The thickness of these layers is between 50 nm and 300 nm. The physical thin-film equipment can also be used in a special module for plasma etching processes. For this purpose, an etching component is added to the plasma, which is necessary for the removal of organic material.
In principle, the terms and conditions of AT&S apply. Individual terms and conditions can also be agreed, but these must be approved separately by AT&S management.
After the first contact via the information page of the AT&S homepage and the decision of the third party to use the R&D thin film equipment, it is mandatory to conclude a non-disclosure agreement in which the purpose and scope are precisely defined.
Depending on the wishes of the interested parties, 2 scenarios can arise: The third party provides test vehicles / prototypes itself, only the R&D equipment are used and after processing the test vehicles / prototypes are sent back for further processing or AT&S is commissioned to manufacture a test vehicle / prototype in which the R&D equipment are used as a central manufacturing component.
Depending on the development status of the R&D equipment, the approved processes are available to the interested party.
An employee of the interested party may be present during the processing of their commissioned or desired prototypes with the R&D equipment - and accompany/observe the process. No audio, photo or video recordings may be made while in the production area.
Process parameters will not be disclosed unless it is a joint development based on a development contract.
If the third party has no or insufficient laboratory equipment, this can be commissioned separately in order to carry out analyses. If these cannot be covered internally, external offers will be obtained.