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Large equipment

EVG Bond & Alignment System

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Silicon Austria Labs GmbH (SAL)

Villach | Website


Short Description

Bond alignment system for universal alignment with proprietary method for micron-level face-to-face wafer alignment.

Contact Person

Heimo Müller

Research Services

Research Services
• Wafer bonding with both optical and mechanical alignment systems
• Anodic bonding, adhesive bonding, metallic bonding, glass frit bonding, etc.
• Double & triple stack Wafer-to-Wafer bonding
• Temporary bonding
• From 4” to 8” wafer sizes
• Wafer bond analysis, bond strength measurement, etc.
• 3D integration via collective Chip 2 Wafer bonding
• Hermetic wafer bonding (bonding under high vacuum, N2, Ar, CO2, etc)
• Wafer preparation & pre-processing for wafer bonds including bond frame micro-fabrication

Methods & Expertise for Research Infrastructure

The EVG bond alignment systems are qualified throughout production environments and offer the highest precision, flexibility and ease of use, and modular upgrade capability. The precision of the bond aligners accommodates the most demanding alignment processes.

Allocation to Core Facility

Silicon Austria Labs GmbH

Terms of Use

The terms of use are to be agreed individually. Send your request to the indicated contact. The GTC of SAL apply: https://silicon-austria-labs.com/agb/

Contact

Heimo Müller
heimo.mueller@silicon-austria.com
https://silicon-austria-labs.com/

Location

Location on map

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