(High Frequency) Electronic Mounting Technology

JKU - Johannes Kepler University Linz

Linz | Website

Large equipment

Short Description

For the construction of prototypes there is a modern automatic SMD assembly machine, a vapor phase soldering machine as well as state-of-the-art equipment for manual soldering work and rapid prototyping technology available.
A wire bonder is also available (for the connection of unpackaged microchips at laminate).

Contact Person

Univ.-Prof. DI Dr. Andreas Stelzer

Research Services

Electronic assembly, prototype construction, rapid prototyping, printed circuit boards (PCBs) and soldering technology

Methods & Expertise for Research Infrastructure

Electronic mounting- and packaging technology, electronic assembly, prototype construction, rapid prototyping, wire bonding

Allocation to Core Facility

High-frequency (measurement) technique

Univ.-Prof. DI Dr. Andreas Stelzer
Institut für Nachrichtentechnik und Hochfrequenzsysteme
+43 732 2468 6372
andreas.stelzer@jku.at
http://www.jku.at/nthfs/
For details please contact the responsible scientist.