The SmartView NT automated bond alignment system for universal alignment offers a proprietary method for micron-level face-to-face wafer-level alignment.
• Wafer stacking for 3D interconnect, wafer-level packaging and high-volume MEMS devices.
• Bond pairs are aligned and clamped prior to loading into the bond chamber (for anodic, adhesive and glass frit bonding).
• Manual or fully automated configurations.
• Suitable for automated process line in 200 mm and 300 mm configurations.
Methods & Expertise for Research Infrastructure
Wafer stacking for 3D interconnect, wafer-level packaging and high-volume MEMS devices.