EVG Bond & Alignment System
Silicon Austria Labs GmbH (SAL)
Bond alignment system for universal alignment with proprietary method for micron-level face-to-face wafer alignment.
Silicon Austria Labs GmbH (SAL)
Bond alignment system for universal alignment with proprietary method for micron-level face-to-face wafer alignment.
University of Natural Resources and Life Sciences Vienna (BOKU)
An Agilent 1290 UHPLC system (using reversed phase or HILIC columns) or a Thermo/Dionex Integrion...
Silicon Austria Labs GmbH (SAL)
This Laser lithography system is a highly versatile, high-resolution pattern generator for direct writing and...
University of Natural Resources and Life Sciences Vienna (BOKU)
The LC-40 system consists of a UHPLC, an autosampler and column oven (both with air...
Silicon Austria Labs GmbH (SAL)
The Helios G4 is a combined electron / focused ion beam microscope for topography and...
Silicon Austria Labs GmbH (SAL)
5G-Testbed for industrial equipment via wireless connections.
Silicon Austria Labs GmbH (SAL)
SAL is the first institution worldwide offering completely new capabilities in high resolution printing to...
JKU - Johannes Kepler University Linz
The ICAROS Lab: Interactive, Collaborative, Adaptive Robotic Systems Lab basically consists of four Niryo.NED collaborative...
Silicon Austria Labs GmbH (SAL)
Clean room class 5 (EN ISO 14644-1), 300 m² - Micro and nano fabrication: M(O)EMS,...
TU Wien
BioSorter® (Union Biometrica) is a large-particle flow cytometer enabling sorting and analysis of objects ranging...